买高导热硅胶片选择美国贝格斯GapPadHC5.0
价格:电议
地区:广东省 东莞市
电 话:0137-98788136
手 机:13798788136
传 真:0769-83814348

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GapPadHC5.0可供规格:

厚度(Thickness)0.51mm 1.02mm 1.52mm 2.03mm 2.54mm 3.18mm

片材(Sheet)8”×16”203×406 mm

卷材(Roll)

导热系数(Thermal Conductivity)5.0W/m-k

基材(Reinfrcement Carrier)玻璃纤维

胶面(Glue)双面自带粘性

颜色(Color)亮紫色

包装(Pack)美国原装包装

击穿电压(Dielectic Breakdown Voltage)Vac:5000

持续使用温度(Continous Use Temp):-60°~200°

GapPadHC5.0应用材料特性:

GapPadHC5.0具有高服贴性,很柔软,材料具有天然粘性,减少了界面热阻,对于易碎元器件产生很小的应力(甚至没有),结构件的完整性,采用玻璃纤维基材,加强剌穿,剪切和能力,低压力场合下具有很好的导热性能。

GapPadHC5.0材料说明:

GapPadHC5.0由玻璃纤维基材填充高导热的高分子聚合物制成,这种材料很柔软,同时具有弹性和服贴性。采用玻璃纤维基材更易于加工和模切,缘效果和能力也更好,材料两边天然的粘性使得GapPadHC5.0更地填充空气间隙,导热性能,材料的上边粘性稍弱,方便于施工操作,在低紧固压力的应用场合,是一种很理想的导热材料。

GapPadHC5.0典型应用:

计算机和外设、通讯设备、热管安装、CD/ROM/DVD-ROM、内存/存储模块、主板和机箱之间、集成电路和数字信号处理器、电压调节模块(VRM)和负荷点电源(POL)、高热量的阵列封装(BGAS

GapPadHC5.0技术优势分析:

GapPadHC5.0是贝格斯家族中GapPad系列理性能好的导热缘材料。其导热系数了的5.0W。一般用于高端产品设备的导热缘作用。是贝格斯硅胶片系列的代表作之一。

GAP PAD? HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during embly. GAP PAD? HC 5.0 maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or ography.

GAP PAD? HC 5.0 is offered with natural inherent tack on both sides of the material, eliminating the need for thermallyimpeding adhesive layers. The side has minimal tack for ease of handling. GAP PAD? HC 5.0 is supplied with protective liners on both sides.