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◆Viewing angle:120 deg
发光角度:120℃
◆The materials of the LED dice is InGaN
芯片成分
◆2.0mm×1.2mm×0.75mm SMT-LED
外型尺寸
◆Lens Appearance: Water Clear
胶体颜色:水色透明
◆ RoHS compliant lead-free soldering compatible
符合ROHS(危害物质禁用指令)要求。
信赖性试验
试验类别Classification | 试验项目 Test Item | 试验条件 Test Condition | 试验设备 Test Equipment | 样品数 Sample Size | 失败率 Failure Rate |
耐久性试验 Endurance Test | 室温通电试验 Operation Life | Temp=(25±5)℃ RH=(50±10)%IF=20mA or 30mA or 50mACheck point: 0hr; 125hrs; 500hrs; 1000hrs | 烧机板 Burn in board | 20 | 0 |
高温高湿储存试验 High Temperature High Humidity Storage | Temp=(85±5)℃ RH=(90%~95%) Check point: 0hr; 125hrs; 500hrs; 1000hrs | 可程式恒温恒湿试验机 Programmable Temp & Humidity Chamber | 20 | 0 | |
高温高湿反向耐压试验 High Temperature High HumidityReverse Bias | Temp=(85±5)℃ RH=(90%~95%) VR=5V Check point: 0hr; 125hrs; 500hrs; 1000hrs | 可程式恒温恒湿试验机 DC=5V电源Programmable Temp & Humidity ChamberPower:DC=5V | 20 | 0 | |
高温储存试验 High Temperature Storage | High Temp=(85±5)℃ Check point: 0hr; 125hrs; 500hrs; 1000hrs | 烤箱 Oven | 20 | 0 | |
低温储存试验 Low Temperature Storage | Low Temp=(-30±5)℃ Check point: 0hr; 125hrs; 500hrs; 1000hrs | 可程式恒温恒湿试验机 Programmable Temp & Humidity Chamber | 20 | 0 | |
环境试验 EnvironmentalTest | 温度循环试验 Temperature Cycle Test | (85±5) ℃ ~ ( -30℃±5) ℃ ~ (85±5) ℃30min 120min 30 min 100minTest time: 0 cycle 10cycle 50cycle 100cycle | 可程式恒温恒湿试验机 Programmable Temp & Humidity Chamber | 20 | 0 |
冷热冲击试验 Thermal Shock Test | (110±5) ℃ ~ ( -30℃±5) ℃ ~ (110±5) ℃15min 8min 15 min 8minTest time: 0 cycle 10cycle 50cycle 100cycle | 气体式冷热冲击试验机 Thermal Shock Tester (Air to Air) | 20 | 0 | |
回流焊试验 Solder Resistance | Temp=260±5℃ Dwell Time=10±1sec; Test times=5 times | 回流焊试验机 Reflow Oven | 20 | 0 | |
焊接特性试验 Solder ability | Temp=230±5℃ Dwell Time=5±1sec; | 锡炉 Tin furnace | 20 |
※Precautions for use使用规范
Reflow Profile回流焊规范
Pb-free Solder temperature Profile无铅产品回流焊温度条件曲线规范
Note: a)Reflow soldering should not be done more than two times.
材料焊接次数不超过2次。
b)Do not put stress on the LEDs when soldering.
焊接时请不要重压LED灯。
c)Do not warp the circuit board before it have been returned to normal ambient conditions
after soldering.
焊接后温度未回降到常温时请勿扭曲线路板。
Hand Soldering Profile手工焊接规范
The temperature of the iron should be lower than 300℃and soldering within 3sec per solder-pad
is to be observed.
手工焊接时,烙铁温度不高于300℃,每个焊脚焊接时间不超过3秒
Storage Profile贮存规范
1. Do not open the moisture proof bag before ready to use the LEDs
请在未准备使用LED之前不要打开防静电袋子。
2. The LEDs should be kept at 30℃or less and 60%RH or less before opening the package.
The max. storage period before opening the package is 1 year.
LED在未开封之前应保存在30℃以下,湿度在60%以下的环境中,长保存期为1年。
3. After opening the package, the LEDs should be kept at 30℃/40%RH or less, and it should be
used within 7 days
打开包装待后,LED需保存在30℃/40%湿度以下的条件,且必须在7天内使用完。
4. If the LEDs be kept over the condition of 3, baking is required before mounting. Baking
condition as below: 60±5℃for 12 hours
如果LED超出了第3点要求,则LED必须经过烘烤才能使用,烘烤条件为:60±5℃,12个
小时