1. RATING額定值:

DC30V0.5A

2. OPERATIONTEMPERATURERANGE使用溫度範圍：

-40~+70℃

3.PRESERVATIVETEMPERATURERANGE：保存溫度範圍：

-40~+85℃

4. CONSTRUCTION DIMENSION結構尺寸：

Apply to the appended drawing：

符合附加圖紙

ITEM项目

TEST CONDITION測試條件

SPECIFICATION規格

5. ELECTRONICAL CHARACTERISTICS.電氣性能.

5A

CONTACT  RESISTANCE

接觸阻抗

Being measured at 1KHz small current contact resistance meter.

在1KHZ小電流下測量.

100mΩ max

100毫歐以下.

5B

INSULATION

RESISTANCE

絕緣阻抗

Measurements shall be made following application of DC1000V potential across terminals and across terminals and frame for 1 minute.

在端子之間和端子與殼之間加DC1000V條件下,持續1分鐘測量.

1000MΩ  min

1000兆歐以上.

5C

WITHSTAND

VOLTAGE

耐電壓

AC500V (50Hz or 60Hz) shall be applied across terminals and across terminals and frame for one minute

在端子之間和端子與殼之間加AC500V(50HZ或60HZ)條件下,持續1分鐘測量.

There shall be no breakdown.

無擊穿現象出現.

6. MECHANICAL CHARACTERISTICS.機械性能.

6A

ACTIONPOWER

动作力

Action Power 5-15N

动作力      5-15N

6B

TERMINAL STRENGTH

端子強度

A static force of 500gf being applied in one direction on the tip of terminal for 1 minute.

一個500克之靜負荷施加於端子頂部的一個方向持續1分鐘。

There shall be no sign of damage mechanically and electrically.

無任何迹象顯示機械及電氣性能之損壞.

7. DURABILITY.耐久性.

7A

SOLDERING TEST.

可焊性試驗

The tip of the terminals shall be dipped 2mm in the solder bath at a temperature of 230±5℃for2±0.5sec.端子頂部被浸入焊錫池2mm深,溫度230±5℃時間2±0.5秒。

A new uniform coating of solder shall cover a minimum of90of the surface being immersed.浸入的部分90%以上表面將被錫覆蓋.

7B

RESISTANCE          TO SOLDERING HEAT

耐焊接熱

Soldering area:t/2 of P.C.B thickness焊接面積：印刷基板的1/2厚度處

temperature:260±5℃Sinkingtime: 5±1S.焊接溫度：260±5℃，焊接時間：5±1秒。

No damage (electrical and mechanical)

無異常。（電氣、機械特性）