Laser Vision Measurement品管量测设备

产品特性（FEATURES）

◆使用Window’s视窗介面，中/英文化书面，操作简单。

◆手动量测锡膏厚度

◆手动测量长、宽及两锡膏间之距离（间距）

◆测量值可记录存档及列印

◆提供厚度分布统计图表及X_Bar_R管制表

◆自动计算制程能力指标CP、CPK、CPM

◆可依不同生产线分别作记录

◆可依基板厚度调整焦距

◆可做定时呼叫取样

◆All operations are easy and using Windows interface in Chinese/English version.

◆Survey thickness of tin solder by auto matica lly or manually.

◆Survey the length and width manually,and the gap of tin solder.

◆Calculate the measure of area, the measure of cross-section and the measure of volumn automatically.

◆All surveyed values can be recorded to a file and be printed to a report.

◆Provide the diagrams of thickness distribution and control diagrams of X_BAR_R.

◆Calculate man facture ability degree automatically(CP, CPK, CPM)

◆It can have proprietary record according to every different production ling.

◆It can adjust focus point in different thickness of PC boards.

◆It can be called to sample periodically.

适用（APPLECATION）

◆各式厚度量测数值取得统计分析

◆锡膏印刷机制程品管检查

◆锡膏印刷厚度良性测量

◆锡膏印刷成型，尺寸量测检查

◆提供其他物品测厚，测长，量测检查

◆Get the results of statistics and analysis about all surveyed values in every thickness degree.

◆Inspect the quality of solder printing process.

◆Survey the thickness benignancy of tin solder

◆Measure the dimension of tin solder

◆Provide thickness and dimension measurement function for other objects

功能（FUNCTION）

◆量测印刷锡膏厚度、长度、高度、间距。

◆提供厚度分布数值参考。

◆提供各种统计分析图表

X管制图、R管制图、厚度列表

X平均值管制图单点列表

◆Surveying the thickness of printing tin solder, length ,height and interval.

◆Provide the references of thickness distribution values.

◆Provide the analysis of different measure of cross-section.

◆Calculate the measure of area and volumn automatically in object which to be surveyed.

◆Provide all diagrams of statistics and analysis.

Provide X control Diagram, R Control Diagram

and Thickness List Diagram. Provide X Average

Control Diagram, Single Point List Diagram.