特征和产品说明：Features and Descriptions:

●标准直径3mm封装   Standard diameter 3mm package 

●长寿命和高可靠性    Long life and high reliability 

●集成电路            I.C. compatible

●芯片材料：铝镓铟磷  Chip material: AlGaInP?

●低功耗             Low Power

●符合ROHS，无铅    RoHS Compliant，no lead

备注：Notes:

●所有尺寸均为毫米（英寸）。

All dimensions are in millimeters (inches).

●  胶体底部树脂凸出不超过1.5mm。

The maximum bulge of resin at the bottom doesn’t exceed 1.5mm .

●  尺寸公差

Tolerance is ±0.25