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热门应用:缺件、偏移、立碑、侧立、多锡、少锡、高度、虚焊、假焊、浮高、翘脚、爬锡,可测PCB绿油出的异物,飞料,OCV技术检测错件和反向.
AOI自诞生起为了解决2维检测的瓶颈尽出现了3D AOI,很好解决了2D AOI无法解决的问题, 但是为了利用3D AOI技术检测元器件,存在很多需要解决的课题。Vitrox 科技的3D AOI完全解决了该瓶颈创造出了业界新的价值。
2D AOI 局限-2D AOI技术基于2D图片来分析, 但是不足于判断所有不良类型。2D 检测方式大部分2D AOI发生误报及漏报 … 工程师技术能力及经验来调试并利用图片信息解决
2D 无法解决板弯(PCB Warp)问题, 板弯导致误报及检测受影响.
3DAOI产线
与现有的2D AOI不同,Vitrox 3D AOI 测量爬锡及元件高度及体积,判定良, 不良,所有Vitrox 3D AOI的检测条件设定方法即直官有简便。 另外V3D AOI基于Vitrox准确信赖性的检测结果数据,实行工程反馈信息,帮助客户工业优化。
1)不受颜色影响的检测能力
2)所有数据的定量化 基于测量的3D AOI超越了2D检测方式,提供准确的不良判断及检测数据.
3 )编程(检测条件)也定量化
4) 创新板弯实时补偿功能
5) OCV, OCR, Polarity Mark 检测功能
6) 真正3D彩色图片
ViTrox V510 3D AOI——先进光学检测设备。在短短的一年半里,它经已获得广泛认可。无论是在检查覆盖率、灵活性、可支持性以及编程方法等方面,V510 3D AOI皆可发挥其卓越的协同作用。V510 3D AOI检测范围广泛,覆盖焊点缺陷、低对比元件位置、错件检查等。
热门应用:缺件、偏移、立碑、侧立、多锡、少锡、高度、IC引脚虚焊、零件起翘、BGA翘起,可测PCB绿油出的异物,飞料,OCV技术检测错件和反向.
主要参数:
Board Dimensions | V510i Optimus 3D1 | V510i 3D XXL |
Maximum board size | 510 mm by 510 mm (20 inch by 20 inch) | 690 mm by 620 mm (27.1inch by 24.4 inch) Upgradable to 690 mm by 960 mm (27.1 inch by 37.8 inch) |
Minimum board size | 50 mm by 50 mm (2 inch by 2 inch) | 50 mm by 50 mm (2 inch by 2 inch) |
Maximum board thickness | 4 mm (0.16 inch) | 15 mm (0.59 inch) |
Minimum board thickness | 0.5 mm (0.02 inch) | 0.5 mm (0.02 inch) |
Board weight | Up to 3 kg (6.6 lb) | Up to 7 kg (15.4 lb) Upgradable to 15 kg |
Maximum inspected area | 503 mm by 510 mm (19.8 inch by 20 inch) | 620 mm by 683 mm (24.4 inch by 26.8 inch) |
Clearance | ||
Top side of board | 50 mm (1.97 inch) | 50 mm (1.97 inch) |
Bottom side of board | 70 mm (2.75 inch) | 70 mm (2.75 inch) |
Minimum edge clearance | 3.5 mm (0.14 inch) | 3.5 mm (0.14 inch) |
Maximum PCB Warpage | +- 5mm | +- 5mm |
Conveyor height range | 856 mm to 965 mm (33.7 inch to 37.9 inch) | 856 mm to 965 mm (33.7 inch to 37.9 inch) |
System Dimensions | ||
Footprint | W: 1060 mm (3.5 ft) x D: 1352 mm (4.4 ft) x H: 2028 mm (6.7 ft) | W: 1460 mm (4.8 ft) x D: 1500 mm (4.9 ft) x H: 2130 mm (6.98 ft) |
Weight | ~ 750 kgs | ~ 1500 kgs |
Functionality | ||
2D Inspection Coverage | Missing, offset, skewed, polarity, billboard, tombstone, lifted/bent leads, excess/insufficient solder, bridging, wrong part | |
3D Inspection Coverage | Package Coplanarity, Lifted Lead, Presence/absence, foreign material, dimple | |
Height Accuracy | ±2μm (on ViTrox adjustment jig) | |
Board level and component level traceability | External barcode reader configured; Camera-read barcodes; OCR capability with batch code logging | |
Hardware Systems | ||
Camera System | 4 mega pixel digital camera; 111-20 μm per pixel resolution | |
Field of view: 40 mm x 40 mm | ||
Lens | Telecentric Lens for 20μm per pixel | |
Telecentric Lens for 11μm per pixel (Optional) | ||
Lighting System | New Lighting Head, 4X Projectors |
主要客户:
贸易商
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马来西亚