焊锡热缩端子soldering tin heat shrink terminal

1:收缩率3:1 minification rate 3:1.

2:含热熔胶具防水功能。Melt glue water proof.

3:热熔胶颜色标示适用尺寸。Melt glue color suit dimension.

4:焊锡环设计容易施工。Solering tin design easy installation.

操作温度范围operation temperature.

工作温度-55℃~125℃ operation temperature-55℃~125℃

完全收缩温度：130℃ full shrink temperature130℃

焊锡开始熔解温度：125℃ soldering tin start liquate temperature

焊锡完全熔解温度：150℃ soldering tin full liquate temperature