供应贴片0805橙色LED灯珠
价格:电议
地区:广东 深圳市
电 话:86 0755 85145356
传 真:86 0755 22141214

Viewing angle:120 deg

   发光角度:120 

The materials of the LED dice is InGaN

   芯片成分

2.0mm×1.2mm×0.75mm SMT-LED

外型尺寸

Lens Appearance: Water Clear

胶体颜色:水色透明

    RoHS compliant lead-free soldering compatible

符合ROHS(危害物质禁用指令)要求。

 

信赖性试验

 

试验类别Classification试验项目
Test Item
试验条件
Test Condition
试验设备
Test Equipment
样品数
Sample Size
失败率
Failure Rate
耐久性试验
Endurance Test
室温通电试验
Operation Life
Temp=(25±5)℃ RH=(50±10)%IF=20mA or 30mA or 50mACheck point: 0hr; 125hrs; 500hrs; 1000hrs烧机板
Burn in board
200
高温高湿储存试验
High Temperature High Humidity Storage
Temp=(85±5)℃ RH=(90%~95%) Check point: 0hr; 125hrs; 500hrs; 1000hrs可程式恒温恒湿试验机

Programmable Temp & Humidity Chamber
200
高温高湿反向耐压试验
High Temperature High HumidityReverse Bias
Temp=(85±5)℃ RH=(90%~95%) VR=5V Check point: 0hr; 125hrs; 500hrs; 1000hrs可程式恒温恒湿试验机
DC=5V电源Programmable Temp & Humidity ChamberPower:DC=5V
200
高温储存试验
High Temperature Storage
High Temp=(85±5)℃  Check point: 0hr; 125hrs; 500hrs; 1000hrs烤箱
Oven
200
低温储存试验
Low Temperature Storage
Low Temp=(-30±5)℃  Check point: 0hr; 125hrs; 500hrs; 1000hrs可程式恒温恒湿试验机
Programmable Temp & Humidity Chamber
200
环境试验
EnvironmentalTest
温度循环试验
Temperature Cycle Test
(85±5) ℃ ~ ( -30℃±5) ℃ ~ (85±5) ℃30min    120min 30 min        100minTest time: 0 cycle 10cycle 50cycle 100cycle可程式恒温恒湿试验机
Programmable Temp & Humidity Chamber
200
冷热冲击试验
Thermal Shock Test
(110±5) ℃ ~ ( -30℃±5) ℃ ~ (110±5) ℃15min   8min 15 min   8minTest time: 0 cycle 10cycle 50cycle 100cycle气体式冷热冲击试验机
Thermal Shock Tester (Air to Air)
200
回流焊试验
Solder Resistance
Temp=260±5℃  Dwell Time=10±1sec; Test times=5 times回流焊试验机
Reflow Oven
200
焊接特性试验
Solder ability
Temp=230±5℃  Dwell Time=5±1sec; 锡炉
Tin furnace
20 

 

 

 

 

 

 

 

Precautions for use使用规范

Reflow Profile回流焊规范

Pb-free Solder temperature Profile无铅产品回流焊温度条件曲线规范

     

 

              

Note: a)Reflow soldering should not be done more than two times.

材料焊接次数不超过2次。

b)Do not put stress on the LEDs when soldering.

焊接时请不要重压LED灯。

c)Do not warp the circuit board before it have been returned to normal ambient conditions

after soldering.

焊接后温度未回降到常温时请勿扭曲线路板。

Hand Soldering Profile手工焊接规范

The temperature of the iron should be lower than 300and soldering within 3sec per solder-pad

is to be observed.

手工焊接时,烙铁温度不高于300,每个焊脚焊接时间不超过3

 

Storage Profile贮存规范

1. Do not open the moisture proof bag before ready to use the LEDs

请在未准备使用LED之前不要打开防静电袋子。

2. The LEDs should be kept at 30or less and 60%RH or less before opening the package.

The max. storage period before opening the package is 1 year.

LED在未开封之前应保存在30以下,湿度在60%以下的环境中,长保存期为1年。

3. After opening the package, the LEDs should be kept at 30/40%RH or less, and it should be

used within 7 days

打开包装待后,LED需保存在30/40%湿度以下的条件,且必须在7天内使用完。

4. If the LEDs be kept over the condition of 3, baking is required before mounting. Baking

condition as below: 60±5for 12 hours

如果LED超出了第3点要求,则LED必须经过烘烤才能使用,烘烤条件为:60±512

小时