● Low profile space
● Ideal for automated placement
● Glass passivated chip junction
● Low forward voltage drop
● Low leakage current
● High forward surge capability
● High temperature soldering：
260℃/10 seconds at terminals
● Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
● Case: MBF Molded plastic
over glass passivated chip
● Terminals: Solder plated, solderable per
J-STD-002B and JESD22-B102D
● Polarity: Polarity symbols marked on body