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产品参数:
Package Dimensions
*Lead spacing is measured where the lead emerges from the package.
*Protruded resin under flange is 1.5mm Max.
Absolute Maximum Ratings (Ta=25℃)
Parameter | Symbol | Rating | Unit |
Continuous Forward Current | IF | 40 | mA |
Peak Forward Current | IFP | 1 | A |
Reverse Voltage | VR | 5 | V |
Operating Temperature | Topr | -40 ~ +85 | ℃ |
Storage Temperature | Tstg | -40 ~ +85 | ℃ |
Soldering Temperature | Tsol | 260 | ℃ |
Power Dissipation at25℃Free Air Temperature | Pd | 70 | mW |
Notes:
- IFPConditions--Pulse Width≦100μs and Duty≦1%.
- Soldering time≦5 seconds.
Electro-Optical Characteristics (Ta=25℃)
Parameter | Symbol | Condition | Min | Typ | Max | Unit |
Radiant Intensity | IE | IF=20mA | 7.8 | 15 | -- | mW/sr |
Radiant Intensity | IE | IF=100mA Pulse Width≦100μs ,Duty≦1% | -- | 140 | -- | mW/sr |
Radiant Intensity | IE | IF=1A Pulse Width≦100μs ,Duty≦1% | -- | 950 | -- | mW/sr |
Peak Wavelength | λp | IF=20mA | -- | 850 | -- | nm |
Spectrial Bandwidth | Δλ | IF=20mA | -- | 45 | -- | nm |
Forward | VF | IF=20mA |
| 1.45 | 1.65 | V |
Forward | VF | IF=100mA Pulse Width≦100μs ,Duty≦1% | -- | 1.8 | 2.40 | V |
Forward Voltage | VF | IF=1A Pulse Width≦100μs ,Duty≦1% | -- | 4.1 | 5.25 | V |
Reverse Current | IR | VR=5V | -- | -- | 5 | μA |
View Angle | 2θ1/2 | IF=20mA | -- | 120 | -- | deg |