Features

Features & Benefits

• Ultra-low capacitance (0.05pF typ.) ideal for high speed data applications
• Provides ESD protection with fast response time (<1ns) allowing equipment to pass IEC 61000-4-2 level 4 test
• Single-line, bi-directional device for placement flexibility
• Low profile 0402/1005 design for board space savings
• Low leakage current (<0.1nA typ.) reduces power con

Environmental Specifications:

• Load Humidity: 12VDC per EIA/IS-772 Para. 4.4.2, +85°C, 85% RH for 1000hours
• Thermal Shock: EIA/IS-722 Para 4.6, Air to Air -55°C to +125°C, 5 cycles
• Moisture Resistance Test: MIL-STD-202G Method 106G, 10 cycles
• Mechanical Shock: EIA/IS-722 Para. 4.9
• Vibration: EIA/IS-722 Para. 4.10
• Resistance to Solvent: EIA/ IS -722 Para. 4.11
• Operating & Storage Temperature Range: -55°C to +125°C

Soldering Recommendations

• Compatible with lead and lead-free solder reflow processes
• Peak reflow temperatures and durations:
• IR Reflow = 260°C max for 10 sec. max.
• Wave Solder = 260°C max