NOTES:
1. CONTACT CHIP CARDS ACCORDING TO ISO7816
  AND PLUG IN SIM-CARD
2. MATERIAL & FINISH:
  HOUSING: HIGH TEMPERATURE THERMOPLASTIC
          UL-94 V0 BLACK
  CONTACT: COPPER ALLOY
  FINISH: GOLD PLATING ON MATING AREA,SEE NOTE 5.
         GOLD FLASH PLATING ON SOLDER AREA
         50u" NICKEL UNDERPLATING OVERALL
  SHELL: STAINLESS STEEL
3. DIMENSION MARKED  SHOULD BE CHECKED BY AND PROCESS
   ENGINEERS, AND SHOUILD  ALSO CHECK THE CPK DATE.
4. FOR SMT REQUIEMENT:
   NO BUBBLE AND DEFORM AFTER REFLOW (260%%DC
   PEAK TEMPERATURE, 10 Seconds MAX. TWO CYCLES)