Features / 特色

防水密封能預防因焊接或清理過程中的汙染物 Sealed against solder and cleaning process contaminants

可有ESD保護物 ESD protection available

有PC腳和SMT腳 Thru-hole and surface mount models

使用面積小節省PCB上的空間 Compact size and small footprint save PCB space

Applications / 應用範圍

電信 Telecommunication 儀器.測試設備 Instrumentation 醫療設備 Medical equipment

SPECIFICATION

Mechanical life:30,000 make-and-break cycles.

Circuit:SPDT

Contact resistance:20mΩmax. initial @ 2-4VDC 100mA for both silver and gold plated contacts.

Insulation resistance:1,000MΩmin.

Dieletric strength:1,000 Vrms min.@sea level.

Degree of protection:IP 67