SD卡卡座垫高1.8满Pin

Notes:
 1.Material:
   Housing: High temperature thermoplastic,
            UL94V_0,Color, Black.
   Contact: Copper alloys.
   Cover: Copper alloys or steel.
 2.Plating:
   Underplate: Nickel.
   Contact area: Gold over nickel.
   Solder area: Tin over nickel.