Features

Features

• 0603/1608 footprint surface mount device
• Ideal ESD protection for high frequency, low voltage applications.
• Provides ESD protection with fast response time (<1ns) allowing equipment to pass IEC 61000-4-2 testing
• Very low leakage current
• Ultra low capacitance (0.15pF maximum)
• Bi-directional

Device Marking

PolySurg™ ESD Suppressors are marked on the tape and reel packages, not individually. Since the product is bi-directional and symmetrical, no orientation marking is required.

Design Consideration

The location in the circuit for the TR series has to be carefully determined. For better performance, the device should be placed as close to the signal input as possible and ahead of any other component. Due to the high current associated with an ESD event, it is recommended to use a “0-stub” pad design (pad directly on the signal/data line and second pad directly on common ground).

Processing Recommendations

The TR series currently has a convex profile on the top surface of the part. This profile is a result of the construction of the device. They can be processed using standard pick-and-place equipment. The placement and processing techniques for these devices are similar to those used for chip resistors and chip capacitors.

Environmental Specifications:

• Moisture Resistance per EIA/IS-722 Paragraph 4.4.2. This standard is based upon MIL-STD-202G Method 103B but with temperature and relative humidity at +85°C and 85% RH respectively. Test condition ‘A’ (240Hr) per MIL-STD-202G.
• Thermal shock: MIL-STD-202, Method 107G, -55°C to 125°C, 30 min. cycle, 10 cycles.
• Vibration: MIL-STD-202F, Method 201A,(10 to 55 to 10 Hz, 1 min. cycle, 2 hrs each in X-Y-Z).
• Chemical resistance: ASTM D-543, 4 hrs @ 40°C, 3 solutions (H2O, detergent solution, defluxer).
• Operating temperature characteristics, measurement at +25°C, +105°C and -56°C.
• Full load voltage: 14.4Vdc, 18Vdc & 24Vdc for 1000 hrs, 25°C.
• Solder leach resistance and terminal adhesion: Per EIA-576.
• Solder ability: MIL-STD-202, Method 208 (95% coverage).

Soldering Recommendations

• Compatible with lead and lead-free solder reflow processes
• Peak reflow temperatures and durations:

- IR Reflow = 260°C max for 10 sec. max.

- Wave Solder = 260°C max. for 10 sec. max.