Features

Features

• Halogen free, lead free and RoHS compliant for global applications
• Ultra-low capacitance (0.1pF typical) ideally suited for protecting high speed data applications
• Provides ESD protection with fast response time (<1ns) allowing equipment to pass the IEC 61000-4-2 Level 4 test
• Four (4) channel array
• Zero signal distortion
• Low leakage current (<0.01μA typical)

Applications

Applied to a high speed signal interface, the 42510ESDA protects:

• Digital video equipment
• Mobile phone
• GPS Antenna
• Bluetooth communication equipment antenna circuit
• IEEE-1394
• DVI
• HDMI

Packaging

• Supplied in tape and reel packaging, 5000 parts per seven inch (178mm) reel per EIA Standard 481-1

Soldering Recommendations

• Compatible with lead and lead-free solder reflow processes
• Hand soldering - soldering tip should not directly touch part - 280°C max for 3 sec. max
• Peak reflow temperatures and durations:

- IR Reflow = 260°C max for 20 sec. max

- Wave Solder = 260°C max for 10 sec. max

Design Considerations

• Follow the soldering recommendations to avoid deforming product
• Do not use high temperature, high humidity or corrosive atmospheres (sulfide and chloride gas) that could damage the solder ability
• Moisture Sensitivity Level (MSL) according to J-STD-020 standard: Level 2 (Floor Life 1 year under <30°C/65%RH conditions)
• Solder ability requirement according to IPC/JEDEC J-STD-002C, Test D, Test B1
• Use Sn/Ag/Cu (96.5/3.0/0.5) or equivalent solder and activated flux #5 or equivalent

Thermal Shock:  -40°C to +85°C, 30 minute cycle, 5 cycles

Moisture Resistance Test:  J-STD-020 Standard: Level 2 (1 year floor life under 30°C/65%RH conditions)

Operating Temperature Range:  -40°C to +85°C (-40°F to 185°F)

Storage Temperature Range: -55°C to +125°C (-67°F to +257°F)

ESD Voltage Capability, IEC 61000-4-2 Contact Discharge Mode: 8kV

ESD Voltage Capability, IEC 61000-4-2  Air Discharge Mode: 15kV

ESD Withstand Pulses: 100 Times Minimal