Description: Electronic Materials SUBA™ Polishing Pads offer significant advantages in achieving consistent, reproducible results in polishing semiconductor wafers, glass and ceramics. May also be used as a sub-pad. |
Used in: - Stock removal on silicon wafers
- Polishing fragile crystals or other delicate surfaces
- Polishing glass, quartz, ceramics, special metals, and plastic
| Advantages: - Range of gradients for stock, intermediate, final, and edge polishing of wafer substrates
- Reduced pad glazing and improved process control in wafer manufacturing
- Ideal for polishing a wide variety of materials
- All grades achieve high precision surfaces and consistent, reproducible results
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IC1000™ Pads
Chemical mechanical polishing pads
Used in: | Advantages: |
- In production of semiconductor devices.
- In tungsten, copper, ILD, STI, and polysilicon processes
- With leading rotary, orbital and belt CMP tools
| - Industry standard pads for chemical mechanical planarization
- Localized planarization
- Excellent removal rates
- Low global non-uniformity and low defectivity
- Wide variety of diameters and shapes – compatible with leading-edge CMP tools
- End point detection available
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FINISHING PADS
Poromeric pads for semiconductor wafer polish
Used in: | Advantages: |
- Wafer polish in semiconductor manufacturing
- Final polish for silicon wafers
| - Produce a featureless, exacting surface finish
- Developed through laboratory and customer testing
- Different combinations of pore structure, polymer type and substrate composition
- Work effectively under a wide variety of polishing conditions
- Permit maximum compatibility with individual processes
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POLITEX™ PADS
Chemical mechanical polishing pads
Used in: | Advantages: |
Various CMP polishing processes including: - Tungsten bulk removal
- Copper barrier removal
- Various buffing steps
| - Industry standard for low-defectivity CMP polishing
- Available in Regular and Hi configurations for all standard CMP polishing tools
- End point detection available
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VISIONPAD™
Copper barrier chemical mechanical polishing pads
Used in: | Advantages: |
- Copper barrier processes
- Production of semiconductor devices
| VisionPads™ have significant performance advantages over other pads in copper barrier processes: - Retain peak performance throughout life of pad
- Higher wafer yields due to low defectivity results during volume production of copper wafers
- Superior chemical mechanical planarization performance
- Improved die yields through minimization of scratches across the wafer
- End point detection available
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