抛光机
价格:电议
地区:黑龙江 哈尔滨市
电 话:0451-51752136
手 机:13613627346
传 真:0451-51752136

Description:

Electronic Materials SUBA#8482; Polishing Pads offer significant advantages in achieving consistent, reproducible results in polishing semiconductor wafers, glass and ceramics. May also be used as a sub-pad.

Used in:

  • Stock removal on silicon wafers
  • Polishing fragile crystals or other delicate surfaces
  • Polishing glass, quartz, ceramics, special metals, and plastic

Advantages:

  • Range of gradients for stock, intermediate, final, and edge polishing of wafer substrates
  • Reduced pad glazing and improved process control in wafer manufacturing
  • Ideal for polishing a wide variety of materials
  • All grades achieve high precision surfaces and consistent, reproducible results

   IC1000#8482; Pads

Chemical mechanical polishing pads

Used in:

Advantages:

  • In production of semiconductor devices.
  • In tungsten, copper, ILD, STI, and polysilicon processes
  • With leading rotary, orbital and belt CMP tools
  • Industry standard pads for chemical mechanical planarization
  • Localized planarization
  • Excellent removal rates
  • Low global non-uniformity and low defectivity
  • Wide variety of diameters and shapes – compatible with leading-edge CMP tools
  • End point detection available


FINISHING PADS

Poromeric pads for semiconductor wafer polish

Used in:

Advantages:

  • Wafer polish in semiconductor manufacturing
  • Final polish for silicon wafers
  • Produce a featureless, exacting surface finish
  • Developed through laboratory and customer testing
  • Different combinations of pore structure, polymer type and substrate composition
  • Work effectively under a wide variety of polishing conditions
  • Permit maximum compatibility with individual processes

 

POLITEX#8482; PADS

Chemical mechanical polishing pads

Used in:

Advantages:

Various CMP polishing processes including:

  • Tungsten bulk removal
  • Copper barrier removal
  • Various buffing steps
  • Industry standard for low-defectivity CMP polishing
  • Available in Regular and Hi configurations for all standard CMP polishing tools
  • End point detection available

 

VISIONPAD#8482;

Copper barrier chemical mechanical polishing pads

Used in:

Advantages:

  • Copper barrier processes
  • Production of semiconductor devices

VisionPads#8482; have significant performance advantages over other pads in copper barrier processes:

  • Retain peak performance throughout life of pad
  • Higher wafer yields due to low defectivity results during volume production of copper wafers
  • Superior chemical mechanical planarization performance
  • Improved die yields through minimization of scratches across the wafer
  • End point detection available

 

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