HEIMANN产小尺寸红外热电堆传感器HMS
价格:电议
地区:江苏省
电 话:025 68551045
品牌HEIMANN型号HMS J21 系列
种类光学材料混合物
材料物理性质半导体材料晶体结构单晶
制作工艺集成输出信号模拟型
防护等级1线性度1(%F.S.)
迟滞1(%F.S.) 重复性1(%F.S.)
灵敏度1漂移1
分辨率1

德国HEIMANN热电堆单通道,气体探测器HMS J21系列

单通道气体分析热电堆探测器,可测量CO2,CO,HC,CH4等气体。
主要技术参数:
探测率:8.7*107cmHz1/2/W
时间常数:10ms
尺寸:TO18 或者TO46

 

The HMS Series of CMOS compatible thermopile sensor chips in TO46 (or TO18) and even smaller transistor housings,
features good sensitivity, small temperature coefficient of sensitivity as well as high reproducibility and reliability.
The smaller package sizes benefit applications in which sensor mounting is a critical parameter. Especially the ultra small
HMS Z11 F5.5 sensor with high symmetry (no orientation tap) opens new design and application possibilities. The HMS Mtypes
offers the possibility to integrate an infrared lens into a TO46 housing and to reduce the field of view accordingly. The
smaller chip TP1 is well suited for temperature measurements which require a precise measuring spot whereas the chip
type TP2 offers higher signal.

 

The HMS Series of CMOS compatible thermopile sensor chips in TO46 (or TO18) and even smaller transistor housings,
features good sensitivity, small temperature coefficient of sensitivity as well as high reproducibility and reliability.
The smaller package sizes benefit applications in which sensor mounting is a critical parameter. Especially the ultra small
HMS Z11 F5.5 sensor with high symmetry (no orientation tap) opens new design and application possibilities. The HMS Mtypes
offers the possibility to integrate an infrared lens into a TO46 housing and to reduce the field of view accordingly. The
smaller chip TP1 is well suited for temperature measurements which require a precise measuring spot whereas the chip
type TP2 offers higher signal.

The HMS Series of CMOS compatible thermopile sensor chips in TO46 (or TO18) and even smaller transistor housings,
features good sensitivity, small temperature coefficient of sensitivity as well as high reproducibility and reliability.
The smaller package sizes benefit applications in which sensor mounting is a critical parameter. Especially the ultra small
HMS Z11 F5.5 sensor with high symmetry (no orientation tap) opens new design and application possibilities. The HMS Mtypes
offers the possibility to integrate an infrared lens into a TO46 housing and to reduce the field of view accordingly. The
smaller chip TP1 is well suited for temperature measurements which require a precise measuring spot whereas the chip
type TP2 offers higher signal.